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Shenzhen Chaosheng Electronic Technology Co.,Ltd

City:hong kong

Province/State:hong kong

Country/Region:china

Contact Person:MrMank.Li

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China Embedded Copper Printed Circuit Board Assembly Services 8 Layers HD3 Level wholesale

Embedded Copper Printed Circuit Board Assembly Services 8 Layers HD3 Level

Name: Embedded Copper Printed Circuit Board Assembly Services 8 Layers HD3 Level
Brand: China chao sheng
Price: 2.28 USD

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Brand Name :China chao sheng

Model Number :CSPCB1530

Certification :ISO/UL/RoHS/TS

Place of Origin :Shenzhen, Guangdong, China

MOQ :1PCS

Price :usd2.28/pcs

Payment Terms :L/C, T/T, Western Union, MoneyGram

Supply Ability :2000K/pcs per month

Delivery Time :15-20day

Packaging Details :Anti-static bag + Anti-static bubble wrap + Good quality carton box

Product Areas :High Power Power Optical Module PCB

Product Structure :8 Layers 3 Steps + Embedded Copper

Surface Finishing :Nickel Palladium + Gold Finger 20U "

Communication Optical Module 5G :FR-4, TG170ISOLA370HR+M6

Surface Treatment :Immersion Gold, Electro-nickel Gold, Immersion Tin, OSP, Lead-free Spray Tin

Provide PCB Information :Gberber, Production Requirements, MOQ Quantity

Impedance Value :± 10%

E-Test :100%

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8 layers HD3 level, embedded copper PCB embedded embedded capacitance / buried resistance PCB Communication Network Optical Module PCB Power Optical Module PCB Wireless Optical Module PCB High Power Optical Module PCB

Printed circuit board (pcb) and PCBA products
Communication terminal, communication station, electronic communication, optical fiber, optical module, communication equipment, communication instrument, computer, household appliance, testing equipment, testing instrument, instrument, SD card, SG card, mobile phone, computer, various antennas, cars, music Equipment, playback equipment, banking equipment, medical instruments, medical equipment, medical equipment, aerospace, aviation, military, LED, OLED, OLCD power control power supply, industrial power supply, communication power supply, automotive power supply, office equipment, digital products,computers,etc.Applications;
Flexible circuit board (FPC) and FPCA product areas
CD, hard disk, printer, fax machine, scanner, sensor, mobile phone, connector, module, walkie-talkie antenna card, high-end camera, digital camera, laser head, CD, medical, instrumentation, drive, automotive instrumentation, medical instrument, Medical equipment, banking equipment, industrial instruments, LED light bars, military, aviation, aerospace, defense and other high-tech products, of which more than 70% of the products are exported to Europe, America, Europe, Central Europe, Western Europe, Southeast Asia, Asia-Pacific and other countries and area.

Product Description

PCBA Technology Capability
Smallest chip placement:0201
Automated axial insertion and Automated radial insertion
Computer controlled Pb free wave soldering system
High speed Pb free surface mount production lines
Providing electronic components purchase service for the customers
ICT on line inspection, PCBA function test equipment, Visual inspection

Product Details

Number of layers: 8L soft and hard combined HDI first-order layered board,
Plate thickness: 1.60mm
Process structure: 3m buried material + FR-4TG170, impedance Ω ± 10%,impedance Ω±10%, resin plug hole + copper fill hole
Buried copper block + nose PAD + minimum hole 0.20mm
Surface treatment: Shen Jin + electricity gold 3u"
Minimum hole copper: 25um
Quantities range from prototype to volume production.
100% E-Test
Packing: vacuum packaging / tin wrapped paper + humidity card + moisture-proof + carton packaging

PCB, FPC process production capability

Technical ltem		MassProduct	Advanced Technology
		2016	2017	2018
Max.Layer Count		26L	36L	80L
Through-hole plate		2～45L	2～60L	2～80L
Max.PCBSize(in)		24*52"	25*62"	25*78.75"
The layer number of FPC		1～36L	1～50L	1～60L
Max.PCBSize(in)		9.8"*196"	9.8"*196"	10"*196"Reel to reel
Layeredplatelayer		2～12L	2～18L	2～26L
Max.PCBSize(in)		9"*48"	9"*52"	9"*62"
Combination of hard and soft layers		3～26L	3～30L	3～50L
Interconnect HDI		5+X+5Interconnect HDI	7+X+7Interconnect HDI	8+X+8,Interconnect HDI
HDI PCB		4～45L	4～60L	4～80L
Interconnect HDI		3+20+3	4+X+4Interconnect HDI	4+X+4,Interconnect HDI
Max.PCBSize(in)		24"*43"	24"*49"	25"*52"
Material		FR-4 Rogers	FR-4 Rogers	FR-4 Rogers
Base material		Halogenfree,LowDK	Halogenfree,LowDK	Halogenfree,LowDK
Build-up Material		FR-4	FR-4	FR-4
BOard,Thickness(mm)	Min.12L(mm)	0.43	0.42～8.0mm	0.38～10.0mm
	Min.16L(mm)	0.53	1.60～8.0mm	0.45～10.0mm
	Min.18L(mm)	0.63	2.0～8.0	0.51～10.0mm
	Min.52L(mm)	0.8	2.50～8.0mm	0.65～10.0mm
	MAX(mm)	3.5	10.0mm	10.0mm
Min.CoreThickness um(mil)		254"(10.0)	254"(10.0)	0.10～254(10.0mm)
Min.Build up Dielectric		38(1.5)	32(1.3)	25(1.0)
BaseCopperWeight	Inner Layer	4/1-8 OZ	4/1-15 OZ	4/1-0.30mm
	Out Layer	4/1-10 OZ	4/1-15 OZ	4/1-30 OZ
Gold thick		1～40u"	1～60u"	1～120u"
Nithick		76～127u"	76～200u"	1～250u"
Min.HOle/Land um(mil)		150/300(6/12)	100/200(4/8)	100/200(4/8)

Min.Laser via/landum(mil)		60/170(2.4/6.8)	50/150(2/6)	50/150(2/6)

Min. IVH,Hole size/landum(mil)		150/300(6/12)	100/200(4/8)	100/200(4/8)

DieletricThickness		38(1.5)	32(1.3)	32(1.3)
		125(5)	125(5)	125(5)
SKipvia		Yes	Yes	Yes

viaoNhie(laserviaon BuriedPTH)		Yes	Yes	Yes

Laser Hole Filling		Yes	Yes	Yes

Technicalltem			Mass Product	Advanced Technolgy
			2017year	2018year	2019year
Drill hole depth ratio		ThroughHole	2017year	.40:1	.40:1
Aspet Ratio		Micro Via	.35:1	1.2:1	1.2:1
Copper Filling Dimple Size um(Mil)			10(0.4)	10(0.4)	10(0.4)
Min.LineWidth＆space		lnner Layer um(mil)	45/45(1.8/1.8)	38/38(1.5/1.5)	38/38(1.5/1.5)
		Plated Layer um(mil)	45/45(1.8/1.8)	38/38(1.5/1.5)	38/38(1.5/1.5)
BGAPitch mm(Mil)			0.3	0.3	0.3
Min.PTH Hole ring um(mil)			75(3mil)	62.5(2.5mil)	62.5(2.5mil)
Line Width Control		∠2.5MIL	±0.50	±0.50	±0.50
		2.5Mil≤L/W∠4mil	±0.50	±0.50	±0.50
		≦3mil	±0.60	±0.60	±0.60
Laminated structure		Layer by layer	3+N+3	4+N+4	5+N+5
		Sequential Build-up	20L Any Layer	36L Any Layer	52L Any Layer
		Multi-layer overlay	N+N	N+N	N+N
			N+X+N	N+X+N	N+X+N
		sequential Lamination	2+(N+X+N)+2	2+(N+X+N)+2	2+(N+X+N)+2
		Soft and hard bonding	2+(N+X+N)+2	2+(N+X+N)+2	2+(N+X+N)+2
PTH filling process			PTH resin plug hole + plating fill Electroplated hole/copper plug hole	PTH resin plug hole + plating fill Electroplated hole/copper plug hole	PTH resin plug hole + plating fill Electroplated hole/copper plug hole

PCB, FPC main material supplier

NO	supplier	Supply material name	Material origin
1	Japan	High frequency materials, PI, covering membrane,Copper berth	Mitsubishi Japan
2	dupont	High frequency materials, PI, covering film, dry film,Copper berth	Japan
3	panasonic	High frequency materials, PI, covering membrane,Copper berth	Japan
4	SanTie	PI, covering membrane	Japan
5	Born good	FR-4,PI,PP,Copper berth	shenzhen, China
6	A rainbow	PI, covering membrane,Copper berth	Taiwan
7	teflon	High frequency materials	The United States
8	Rogers	High frequency materials	The United States
9	Nippon Steel	PI, covering membrane,Copper berth	Taiwan
10	sanyo	PI, covering membrane,Copper berth	Japan
11	South Asia	FR-4,PI,PP,Copper berth	Taiwan
12	doosan	FR-4,PP	South Korea
13	Tai Yao plate	FR-4,PP,Copper berth	Taiwan
14	Alight	FR-4,PP,Copper berth	Taiwan
15	Yaoguang	FR-4,PP,Copper berth	Taiwan
16	Yalong	FR-4,PP	The United States
17	ISOAL	FR-4,PP	Japan
18	OAK	Buried, buried resistance, PP	Japan
19	United States 3M	FR-4,PP	The United States
20	Bergs	Copper and aluminum matrix	Japan
21	The sun	ink	Taiwan
22	Murata	ink	Japan
23	generous andbenevolent	PI, covering membrane,Copper berth	China's jiangxi
24	Yasen	PPI, covering membrane	China jiangsu
25	Yong Sheng Tai	ink	China guangdong panyu
26	mita	ink	Japan
27	Transcript	ceramic material	Taiwan

28	HOME	ceramic material	Japan

29	Fe-Ni-Mn	Alloy Invar, Section Steel	Taiwan

PCBs material: FR-4, 0.5oz - 6oz copper
0.45 to 3.2mm thickness
Minimum line width and line spacing: 4mil/4mil
Minimum hole diameter: 0.2mm
Maximum panel size: 680 x 1280mm
Surface finishing:

HAL, alpha level, gold plating, ENTech
HAL or tin and gold plating

Solder mask type: liquid photoimageable solder mark
Precision V-cut or routing for panel form design
OEM orders for SMT and A/I assembly projects accepted
Gerber file preferred
Please note the following information are for your reference on our manufacturing capability, not for inquiries on quotations
We will offer our best prices if you can send your own PCB design

Product Details:
Place of Origin:China
Brand Name:XCE
Certification:CE,ROHS, FCC,ISO9008,SGS,UL
Model Number:XCEH
Minimum Order Quantity:1pcs
Price:negotiation
Packaging Details:inner: vacuum-packed bubble bag outer: carton box
Delivery Time:5-10 days
Payment Terms:T/T,Western union
Supply Ability:1, 000, 000 PCS / week

Advantage Highlights

Specialized in 2- to 32-layer PCB
ISO 9001-, ISO 14001- and ISO/TS 16949-certified
Products are UL- and RoHS-certified
Partner for over 2000 small- and medium-scale customers
Two factory bases totaling 22,000 square meters
Less than 12-hours quick response to inquiries
Widely acclaimed and satisfying services
Over 66% of PCBs are exported to international markets

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