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Shenzhen Chaosheng Electronic Technology Co.,Ltd

City:hong kong

Province/State:hong kong

Country/Region:china

Contact Person:MrMank.Li

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China SMT FPC TEST DIP Surface Mount PCB Assembly Services 1Oz OEM Electronics Usage wholesale

SMT FPC TEST DIP Surface Mount PCB Assembly Services 1Oz OEM Electronics Usage

Name: SMT FPC TEST DIP Surface Mount PCB Assembly Services 1Oz OEM Electronics Usage
Brand: China chao sheng
Price: 12.23 USD

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Brand Name :China chao sheng

Model Number :CSPCBA1530

Certification :ISO/UL/RoHS/TS

Place of Origin :Shenzhen, Guangdong, China

MOQ :1PCS

Price :12.23usd/pcs

Payment Terms :L/C, T/T, Western Union, MoneyGram

Supply Ability :200K/pcs per month

Delivery Time :15-20day

Packaging Details :Anti-static bag + Anti-static bubble wrap + Good quality carton box

Surface Finishing :HASL Lead Free

Min. Line Spacing :3 Mil (0.075 Mm)

Layer :12layers+ SMT + TEST + DIP

Usage :OEM Electronics

Copper Thickness :1Oz

Solder Mask Color :Black.Red.Yellow.White.Blue.Green

Impedance Value :± 10%

E-Test :100%

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Surface Mount PCB Assembly Services SMT FPC + SMT + TEST + DIP, SMT PCB, procurement PCB PCBA SMT PCB Service,carton packaging
Accelerated Assemblies offers the latest technical capabilities to meet your most demanding project requirements for circuit card assembly. Whether we assemble your product with BGA, Micro-BGA Surface Mount (SMT) PCBs have gained immense popularity in the recent years, owing to several beneficial features they offer. These PCBs are compact sized, and they perfectly meet the growing demand for miniature electronics. At Accelerated Assemblies, we have over 20 years of experience in delivering the highest quality SMT assembly services. In these circuit boards, the components are directly mounted on the PCBs. We utilize several fully automated equipment to accurately position the components on the PCB. Our unwavering commitment to quality has helped us deliver SMT PCB assemblies, which are known to offer consistent performance for a long time.

Printed circuit board (pcb) and PCBA products
Communication terminal, communication station, electronic communication, optical fiber, optical module, communication equipment, communication instrument, computer, household appliance, testing equipment, testing instrument, instrument, SD card, SG card, mobile phone, computer, various antennas, cars, music Equipment, playback equipment, banking equipment, medical instruments, medical equipment, medical equipment, aerospace, aviation, military, LED, OLED, OLCD power control power supply, industrial power supply, communication power supply, automotive power supply, office equipment, digital products,computers,etc.Applications;
Flexible circuit board (FPC) and FPCA product areas
CD, hard disk, printer, fax machine, scanner, sensor, mobile phone, connector, module, walkie-talkie antenna card, high-end camera, digital camera, laser head, CD, medical, instrumentation, drive, automotive instrumentation, medical instrument, Medical equipment, banking equipment, industrial instruments, LED light bars, military, aviation, aerospace, defense and other high-tech products, of which more than 70% of the products are exported to Europe, America, Europe, Central Europe, Western Europe, Southeast Asia, Asia-Pacific and other countries and area.

SMT Assembly Capabilities of Accelerated Assemblies

Over the years, we have improved our SMT assembly services to meet complex client requirements. The following capabilities have contributed to our growth as a leading surface mount assembly services in the US.

pcb product field:
Communication terminal, communication station, electronic communication, computer, home appliance, electrical appliance, SD card, SG card, mobile phone, computer, automobile, finance, aerospace, aviation, medical, military, led, power control power supply, industrial power supply, computer, office Equipment, digital products, computers, LCD, etc .;
fpc product field:
CD-ROM, hard disk, printer, fax machine, scanner, sensor, mobile phone, walkie-talkie antenna card, high-end camera, digital, camera, laser head, CD-ROM, medical, instrumentation, drive, automotive instrumentation, medical instrument, led light, lighting, Copper-based electronics, aviation, aviation, national defense and other high-tech products, more than 70% of the products are exported to the Americas, Europe, Japan, Asia Pacific and other countries and regions.

Component Packages: Currently, we can assemble the following component packages:
- Ball Grid Array (BGA)
- Ultra-fine Ball Grid Array (uBGA)
- 0201 and larger chip-type components
- Quad Flat Pack No-Lead (QFN)
- Small Outline Integrated Circuit (SOIC)
- Plastic Leaded Chip Carrier (PLCC)
- Quad Flat Package (QFP)
- Package-On-Package (PoP)
- Chip-scale Package (CSP)
- Board Sizes: We can provide the SMT assemblies in the following board sizes:
- 2″x2″ (50.8mm x 50.8mm) min to 20″x18″ (508mm x 457.2mm) max
- Single sided
- Double sided
Fine Pitch Placement: Our fine pitch placement ability is not limited to these:
- Leaded Minimums : .0065″ (.16mm) width /.010″ (.25mm) pitch
- CSP/BGA Minimums: .010″ (.25mm) diameter / .021″ (.53mm) pitch
Standards and Compliances: Our surface mount assembly services adhere to the following standards and compliances:
- ISO 9001:2008 certified
- RoHS
- ISO: 13485:2003 certified
- MIL-PRF-55110
- ITAR
High-speed Automation: We rely on the following state-of-the-art SMT lines for ensuring the fastest production in the industry.
- Stencil Printing Machine
- Flexible Component Placement Systems
- Reflow Ovens
- Rheometer ( for adhesives, solder pastes, and epoxy analysis)
- Wave Soldering Systems
- Acoustics Scanning Microscopes ( for crack and void checking)
- Microscopy X-ray Inspection Machine
- Vitronics Reflow Ovens
- In-line Aqueous Cleaners
Testing and Inspection: Every PCB manufactured at our facility undergoes rigorous testing and inspection. We assure 100% AOI (Automated Optical Inspection) of Surface Mount Assemblies. We employ the following evaluation process to ensure the highest quality of the PCBs.
- Vibration and Shock Testing
- Scanning Electron Microscopy (SEM)
- Cross-sectioning, Specimen Preparation and Evaluation
- Humidity and Temperature Testing
Environment Chamber: Humidity and temperature are the two factors that may have a negative impact on the assembly process. Thus, we tightly monitor and control these processes inside our facility to minimize their impact. We also take precautions to protect the sensitive electronic components on the printed circuit board from ESD (Electrostatic Discharge).

For more information about Accelerated Assemblies surface mount assembly services, please contact usat the earliest. Our experts are eager to help you with the right specifications, and value effective surface mount PCB assembly services.

FAQ:

Q: What files do you use in PCB fabrication?

A: Gerber or Eagle, BOM listing, X, Y sitting report, PNP and Components Position

Q: Is it possible you could offer sample?

A: Yes, we can custom you sample to test before mass production

Q: When will I get the quotation after sent Gerber, BOM and test procedure?

A: Within 6-48hours for PCB quotation and around 24-48 hours for PCBA quotation.

Q: According to the difficulty of high-layer boards, How can I know the process of my PCB production?

A: 7-35days for PCB production and components purchasing, and 14-20days for PCB assembly and Testing

Q: How can I make sure the quality of my PCB?

A: We ensure that each piece of PCB, PCBA products work well before shipping. We'll test all of them according to your test procedure.

PCB, FPC process production capability

Technical ltem		MassProduct	Advanced Technology
		2016	2017	2018
Max.Layer Count		26L	36L	80L
Through-hole plate		2～45L	2～60L	2～80L
Max.PCBSize(in)		24*52"	25*62"	25*78.75"
The layer number of FPC		1～36L	1～50L	1～60L
Max.PCBSize(in)		9.8"*196"	9.8"*196"	10"*196"Reel to reel
Layeredplatelayer		2～12L	2～18L	2～26L
Max.PCBSize(in)		9"*48"	9"*52"	9"*62"
Combination of hard and soft layers		3～26L	3～30L	3～50L
Interconnect HDI		5+X+5Interconnect HDI	7+X+7Interconnect HDI	8+X+8,Interconnect HDI
HDI PCB		4～45L	4～60L	4～80L
Interconnect HDI		3+20+3	4+X+4Interconnect HDI	4+X+4,Interconnect HDI
Max.PCBSize(in)		24"*43"	24"*49"	25"*52"
Material		FR-4 Rogers	FR-4 Rogers	FR-4 Rogers
Base material		Halogenfree,LowDK	Halogenfree,LowDK	Halogenfree,LowDK
Build-up Material		FR-4	FR-4	FR-4
BOard,Thickness(mm)	Min.12L(mm)	0.43	0.42～8.0mm	0.38～10.0mm
	Min.16L(mm)	0.53	1.60～8.0mm	0.45～10.0mm
	Min.18L(mm)	0.63	2.0～8.0	0.51～10.0mm
	Min.52L(mm)	0.8	2.50～8.0mm	0.65～10.0mm
	MAX(mm)	3.5	10.0mm	10.0mm
Min.CoreThickness um(mil)		254"(10.0)	254"(10.0)	0.10～254(10.0mm)
Min.Build up Dielectric		38(1.5)	32(1.3)	25(1.0)
BaseCopperWeight	Inner Layer	4/1-8 OZ	4/1-15 OZ	4/1-0.30mm
	Out Layer	4/1-10 OZ	4/1-15 OZ	4/1-30 OZ
Gold thick		1～40u"	1～60u"	1～120u"
Nithick		76～127u"	76～200u"	1～250u"
Min.HOle/Land um(mil)		150/300(6/12)	100/200(4/8)	100/200(4/8)

Min.Laser via/landum(mil)		60/170(2.4/6.8)	50/150(2/6)	50/150(2/6)

Min. IVH,Hole size/landum(mil)		150/300(6/12)	100/200(4/8)	100/200(4/8)

DieletricThickness		38(1.5)	32(1.3)	32(1.3)
		125(5)	125(5)	125(5)
SKipvia		Yes	Yes	Yes

viaoNhie(laserviaon BuriedPTH)		Yes	Yes	Yes

Laser Hole Filling		Yes	Yes	Yes

Technicalltem			Mass Product	Advanced Technolgy
			2017year	2018year	2019year
Drill hole depth ratio		ThroughHole	2017year	.40:1	.40:1
Aspet Ratio		Micro Via	.35:1	1.2:1	1.2:1
Copper Filling Dimple Size um(Mil)			10(0.4)	10(0.4)	10(0.4)
Min.LineWidth＆space		lnner Layer um(mil)	45/45(1.8/1.8)	38/38(1.5/1.5)	38/38(1.5/1.5)
		Plated Layer um(mil)	45/45(1.8/1.8)	38/38(1.5/1.5)	38/38(1.5/1.5)
BGAPitch mm(Mil)			0.3	0.3	0.3
Min.PTH Hole ring um(mil)			75(3mil)	62.5(2.5mil)	62.5(2.5mil)
Line Width Control		∠2.5MIL	±0.50	±0.50	±0.50
		2.5Mil≤L/W∠4mil	±0.50	±0.50	±0.50
		≦3mil	±0.60	±0.60	±0.60
Laminated structure		Layer by layer	3+N+3	4+N+4	5+N+5
		Sequential Build-up	20L Any Layer	36L Any Layer	52L Any Layer
		Multi-layer overlay	N+N	N+N	N+N
			N+X+N	N+X+N	N+X+N
		sequential Lamination	2+(N+X+N)+2	2+(N+X+N)+2	2+(N+X+N)+2
		Soft and hard bonding	2+(N+X+N)+2	2+(N+X+N)+2	2+(N+X+N)+2
PTH filling process			PTH resin plug hole + plating fill Electroplated hole/copper plug hole	PTH resin plug hole + plating fill Electroplated hole/copper plug hole	PTH resin plug hole + plating fill Electroplated hole/copper plug hole

Titan PCB Lead Time (Days)

Items	Sample	High Volume
Single Sided PCB	1-3	4-7
Double Sided PCB	2-5	7-10
Multi-layer PCB	7-8	10-15
PCB Making & Assembly	8-15	15-20

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