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Shenzhen Chaosheng Electronic Technology Co.,Ltd

Chaosheng Group (Hong Kong) Technology Development Co., Ltd. Shenzhen Chaosheng Electronic Technology Co.,Ltd Zhejiang Kunyu Electronic Technology Co., Ltd. Shenzhen Mingze Electronic Technology Co.,

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Home / Products / IC Package Substrate / CU9/1um Molded Interconnect Substrate PIGL042504-250MH Baoli Oil + PI Reinforcement /

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PCB Board Service

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Flexible Rigid PCB

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Large PCB Prototype Board

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HDI Printed Circuit Boards

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Ultra Thin PCB

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Multilayer Printed Circuit Board

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PCB Printing Service

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FR4 Printed Circuit Board

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High Frequency PCB

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Metal Substrate PCB

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Copper Substrate PCB

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IC Circuit Board

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IC Package Substrate

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Shenzhen Chaosheng Electronic Technology Co.,Ltd
City:hong kong
Province/State:hong kong
Country/Region:china
Contact Person:MrMank.Li
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CU9/1um Molded Interconnect Substrate PIGL042504-250MH Baoli Oil + PI Reinforcement
CU9/1um Molded Interconnect Substrate PIGL042504-250MH Baoli Oil + PI Reinforcement
  • CU9/1um Molded Interconnect Substrate PIGL042504-250MH Baoli Oil + PI Reinforcement
  • CU9/1um Molded Interconnect Substrate PIGL042504-250MH Baoli Oil + PI Reinforcement
  • CU9/1um Molded Interconnect Substrate PIGL042504-250MH Baoli Oil + PI Reinforcement
  • CU9/1um Molded Interconnect Substrate PIGL042504-250MH Baoli Oil + PI Reinforcement
  • CU9/1um Molded Interconnect Substrate PIGL042504-250MH Baoli Oil + PI Reinforcement
  • CU9/1um Molded Interconnect Substrate PIGL042504-250MH Baoli Oil + PI Reinforcement
Products Detailed
mobile phone COF driver Panasonic material PIGL042504-250MH, CU9/1um, Baoli oil + PI reinforcement Product Description Number of floors: 1 floor Plate ...
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Product Tags:
cordierite dpf substrate dpf substrate inconel filler metal 625

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