Shenzhen Chaosheng Electronic Technology Co.,Ltd

Chaosheng Group (Hong Kong) Technology Development Co., Ltd. Shenzhen Chaosheng Electronic Technology Co.,Ltd Zhejiang Kunyu Electronic Technology Co., Ltd. Shenzhen Mingze Electronic Technology Co.,

Manufacturer from China
Active Member
6 Years
Home / Products / SMT PCB Service /

​36Layers arbitrary order HDI plate ,Mitsui SablcM4+3M buri woodenbox,SMTPCB Service,high speed pcb layout,humidity card

Contact Now
Shenzhen Chaosheng Electronic Technology Co.,Ltd
City:hong kong
Province/State:hong kong
Country/Region:china
Contact Person:MrMank.Li
Contact Now

​36Layers arbitrary order HDI plate ,Mitsui SablcM4+3M buri woodenbox,SMTPCB Service,high speed pcb layout,humidity card

Ask Latest Price
Video Channel
Brand Name :China chao sheng
Model Number :CSPCB1493
Place of Origin :Shenzhen, Guangdong, China
MOQ :1PCS
Price :Negotiation
Payment Terms :T/T, Western Union
Supply Ability :5-200K/pcs per month
Delivery Time :5-40day
Packaging Details :Anti-static bag + Anti-static bubble wrap + Good quality carton box
Certification :ISO/UL/RoHS/TS
Surface finishing :HASL Lead Free
Base material :FR4
Min. line spacing :3 Mil (0.075 mm)
Board thickness :1.6mm
Min. line width :0.075mm/0.1mm(3mil/4mil)
Copper thickness :0.25 oz -12 oz
Solder mask :Black
Service :Component Source
Solder mask color :Black.Red.Yellow.White.Blue.Green
Type :Electronic Board
Layer :1-24layers
Usage :OEM Electronics
Layers :​36Layers arbitrary order HDI+ SMT + plug-in + back soldering
more
Contact Now

Add to Cart

Find Similar Videos
View Product Description

36Layers arbitrary order HDI plate ,Mitsui SablcM4+3M buri woodenbox,SMTPCB Service,high speed pcb layout,humidity card

Printed circuit board (pcb) and PCBA products
Communication terminal, communication station, electronic communication, optical fiber, optical module, communication equipment, communication instrument, computer, household appliance, testing equipment, testing instrument, instrument, SD card, SG card, mobile phone, computer, various antennas, cars, music Equipment, playback equipment, banking equipment, medical instruments, medical equipment, medical equipment, aerospace, aviation, military, LED, OLED, OLCD power control power supply, industrial power supply, communication power supply, automotive power supply, office equipment, digital products,computers,etc.Applications;
Flexible circuit board (FPC) and FPCA product areas
CD, hard disk, printer, fax machine, scanner, sensor, mobile phone, connector, module, walkie-talkie antenna card, high-end camera, digital camera, laser head, CD, medical, instrumentation, drive, automotive instrumentation, medical instrument, Medical equipment, banking equipment, industrial instruments, LED light bars, military, aviation, aerospace, defense and other high-tech products, of which more than 70% of the products are exported to Europe, America, Europe, Central Europe, Western Europe, Southeast Asia, Asia-Pacific and other countries and area.

.

Product Description

  1. Electronic Circuit Board Assembly SMT PCB Assembly FR4 1OZ Cooper
  2. 36L arbitrary order HDI plate thickness 3.20mm; Mitsui SablcM4+3M buried, turnkey pcb assembly, pcb printing service+SMT+ component purchasing + plugin,
  3. Product field: military system products
  4. Number of layers: 36L arbitrary order HDI plate thickness 3.20mm;
  5. Size: 225*176mm/1PCS
  6. Process structure: Mitsui SablcM4+3M buried, minimum hole 0.40mm, copper thickness 1OZ, line width line spacing 4/3mil, Impedance Ω ± 10%
  7. Surface treatment: Shen Jin 4u"
  8. Printed Circuit Boards are 94V0 compliant, and adhere to IPC610 Class 2 international PCB
  9. Standard.
  10. Quantities range from prototype to volume production.
  11. 100% E-Test
  12. Packing: vacuum packaging / tin wrapped paper + humidity card + moisture-proof + carton packaging

PCB, FPC process production capability

Technical ltem MassProduct Advanced Technology
2016 2017 2018
Max.Layer Count 26L 36L 80L
Through-hole plate 2~45L 2~60L 2~80L
Max.PCBSize(in) 24*52" 25*62" 25*78.75"
The layer number of FPC 1~36L 1~50L 1~60L
Max.PCBSize(in) 9.8"*196" 9.8"*196" 10"*196"Reel to reel
Layeredplatelayer 2~12L 2~18L 2~26L
Max.PCBSize(in) 9"*48" 9"*52" 9"*62"
Combination of hard and soft layers 3~26L 3~30L 3~50L
Interconnect HDI 5+X+5Interconnect HDI 7+X+7Interconnect HDI 8+X+8,Interconnect HDI
HDI PCB 4~45L 4~60L 4~80L
Interconnect HDI 3+20+3 4+X+4Interconnect HDI 4+X+4,Interconnect HDI
Max.PCBSize(in) 24"*43" 24"*49" 25"*52"
Material FR-4 Rogers FR-4 Rogers FR-4 Rogers
Base material Halogenfree,LowDK Halogenfree,LowDK Halogenfree,LowDK
Build-up Material FR-4 FR-4 FR-4
BOard,Thickness(mm) Min.12L(mm) 0.43 0.42~8.0mm 0.38~10.0mm
Min.16L(mm) 0.53 1.60~8.0mm 0.45~10.0mm
Min.18L(mm) 0.63 2.0~8.0 0.51~10.0mm
Min.52L(mm) 0.8 2.50~8.0mm 0.65~10.0mm
MAX(mm) 3.5 10.0mm 10.0mm
Min.CoreThickness um(mil) 254"(10.0) 254"(10.0) 0.10~254(10.0mm)
Min.Build up Dielectric 38(1.5) 32(1.3) 25(1.0)
BaseCopperWeight Inner Layer 4/1-8 OZ 4/1-15 OZ 4/1-0.30mm
Out Layer 4/1-10 OZ 4/1-15 OZ 4/1-30 OZ
Gold thick 1~40u" 1~60u" 1~120u"
Nithick 76~127u" 76~200u" 1~250u"
Min.HOle/Land um(mil) 150/300(6/12) 100/200(4/8) 100/200(4/8)
Min.Laser via/landum(mil) 60/170(2.4/6.8) 50/150(2/6) 50/150(2/6)
Min. IVH,Hole size/landum(mil) 150/300(6/12) 100/200(4/8) 100/200(4/8)
DieletricThickness 38(1.5) 32(1.3) 32(1.3)
125(5) 125(5) 125(5)
SKipvia Yes Yes Yes
viaoNhie(laserviaon BuriedPTH) Yes Yes Yes
Laser Hole Filling Yes Yes Yes
Technicalltem Mass Product Advanced Technolgy
2017year 2018year 2019year
Drill hole depth ratio ThroughHole 2017year .40:1 .40:1
Aspet Ratio Micro Via .35:1 1.2:1 1.2:1
Copper Filling Dimple Size um(Mil) 10(0.4) 10(0.4) 10(0.4)
Min.LineWidth&space lnner Layer um(mil) 45/45(1.8/1.8) 38/38(1.5/1.5) 38/38(1.5/1.5)
Plated Layer um(mil) 45/45(1.8/1.8) 38/38(1.5/1.5) 38/38(1.5/1.5)
BGAPitch mm(Mil) 0.3 0.3 0.3
Min.PTH Hole ring um(mil) 75(3mil) 62.5(2.5mil) 62.5(2.5mil)
Line Width Control ∠2.5MIL ±0.50 ±0.50 ±0.50
2.5Mil≤L/W∠4mil ±0.50 ±0.50 ±0.50
≦3mil ±0.60 ±0.60 ±0.60
Laminated structure Layer by layer 3+N+3 4+N+4 5+N+5
Sequential Build-up 20L Any Layer 36L Any Layer 52L Any Layer
Multi-layer overlay N+N N+N N+N
N+X+N N+X+N N+X+N
sequential Lamination 2+(N+X+N)+2 2+(N+X+N)+2 2+(N+X+N)+2
Soft and hard bonding 2+(N+X+N)+2 2+(N+X+N)+2 2+(N+X+N)+2
PTH filling process PTH resin plug hole + plating fill
Electroplated hole/copper plug hole
PTH resin plug hole + plating fill
Electroplated hole/copper plug hole
PTH resin plug hole + plating fill
Electroplated hole/copper plug hole

Our Quality processes include:
1. IQC: Incoming Quality Control (Incoming Materials Inspection)
2. First Article Inspection for every process
3. IPQC: In Process Quality Control
4. QC: 100% Test & Inspection
5. QA: Quality Assurance based on QC inspection again
6. Workmanship: IPC-A-610, ESD
7. Quality Management based on CQC, ISO9001:2008, ISO 14001:2004

Certificates:
ISO9001-2008
ISO/TS16949
UL
IPC-A-600G and IPC-A-610E Class II compliance
Customer's requirements

Quick Detail:

1. PCB Assembly on SMT and DIP

2. PCB schematic drawing/ layout /producing

3. PCBA clone/change board

4. Components sourcing and purchasing for PCBA

5. Enclosure design and plastic injection molding

6. Full range of testing services. Including: AOI, Fuction Testing , In Circuit Testing, X-Ray For BGA Testing,

7. IC programming

Surface treatment: full board OSP, full board immersion gold, whole board electric nickel gold, electric gold + immersion gold, electric gold + OSP, OSP + immersion gold, OSP + carbon bridge, gold finger, OSP + gold finger, immersion gold + gold finger, Shen tin, immersion silver, lead-free tin spray

PCB, FPC product application field

Various digital products, automotive new energy, automotive products, military, aerospace, medical, wireless terminals, wired terminals, communication equipment, communication stations, finance, industrial industrial control, consumer electronics, educational equipment, smart devices, smart products, security, LED, computer, mobile phone and other electronic products

FAQ:

Q: What files do you use in PCB fabrication?

A: Gerber or Eagle, BOM listing, X, Y sitting report, PNP and Components Position

Q: Is it possible you could offer sample?

A: Yes, we can custom you sample to test before mass production

Q: When will I get the quotation after sent Gerber, BOM and test procedure?

A: Within 6-48hours for PCB quotation and around 24-48 hours for PCBA quotation.

Q: According to the difficulty of high-layer boards, How can I know the process of my PCB production?

A: 7-35days for PCB production and components purchasing, and 14-20days for PCB assembly and Testing

Q: How can I make sure the quality of my PCB?

A: We ensure that each piece of PCB, PCBA products work well before shipping. We'll test all of them according to your test procedure.

​36Layers arbitrary order HDI plate ,Mitsui SablcM4+3M buri woodenbox,SMTPCB Service,high speed pcb layout,humidity card​36Layers arbitrary order HDI plate ,Mitsui SablcM4+3M buri woodenbox,SMTPCB Service,high speed pcb layout,humidity card

Inquiry Cart 0