Shenzhen Chaosheng Electronic Technology Co.,Ltd

Chaosheng Group (Hong Kong) Technology Development Co., Ltd. Shenzhen Chaosheng Electronic Technology Co.,Ltd Zhejiang Kunyu Electronic Technology Co., Ltd. Shenzhen Mingze Electronic Technology Co.,

Manufacturer from China
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5 Years
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8-layer 3rd-order Bluetooth headset with hard and soft HDI, ENIG Surface Finishing Printed Circuit Board Pcb FR4 / Polyi

8-layer 3rd-order Bluetooth headset with hard and soft HDI, ENIG Surface Finishing Printed Circuit Board Pcb FR4 / Polyi

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Brand Name :Shenzhen, Guangdong, China
Model Number :cspcb1757
Certification :ISO/UL/RoHS/TS
Place of Origin :China chao sheng
MOQ :1PCS
Price :usd2.1-2.6/pcs
Payment Terms :T/T, L/C, Western Union, MoneyGram
Supply Ability :5K-20K/pcs per month
Delivery Time :18-20day
Packaging Details :Anti-static bag + Anti-static bubble wrap + Good quality carton box
Product Type :Bluetooth headset
Material :DuPont PI+ cover film
Line width and distance :2.7/4mil
Copper thickness: inner layer copper thickness :35um
Impedance :±10%
Hole treatment :resin plug hole
Surface treatment :ENIG
Impedance tolerance :±10%
Solder mask :cover film + green solder mask
Thickness :hard board thickness 0.60mm±10%, soft board thickness 0.15mm±10%
E-Test :100%
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8-layer 3rd-order Bluetooth headset with hard and soft HDI, ENIG Surface Finishing Printed Circuit Board Pcb FR4 / Polyimide Material, rigid flex circuit boards
structure
Product Type: Bluetooth headset
Smallest hole
Material: DuPont PI+ cover film
Line width and distance 2.5/2.3mil,
Copper thickness: inner layer copper thickness 0.5OZ, impedance ±10%,
Hole treatment: resin plug hole,
Surface treatment: Shen Jin,
Impedance tolerance: ±10%
Solder mask: cover film + green solder mask,
Thickness: hard board thickness 0.60mm±10%, soft board thickness 0.15mm±10%
E-Test: 100%

Printed circuit board (pcb) and PCBA products
Communication terminal, communication station, electronic communication, optical fiber, optical module, communication equipment, communication instrument, computer, household appliance, testing equipment, testing instrument, instrument, SD card, SG card, mobile phone, computer, various antennas, cars, music Equipment, playback equipment, banking equipment, medical instruments, medical equipment, medical equipment, aerospace, aviation, military, LED, OLED, OLCD power control power supply, industrial power supply, communication power supply, automotive power supply, office equipment, digital products,computers,etc.Applications;
Flexible circuit board (FPC) and FPCA product areas
CD, hard disk, printer, fax machine, scanner, sensor, mobile phone, connector, module, walkie-talkie antenna card, high-end camera, digital camera, laser head, CD, medical, instrumentation, drive, automotive instrumentation, medical instrument, Medical equipment, banking equipment, industrial instruments, LED light bars, military, aviation, aerospace, defense and other high-tech products, of which more than 70% of the products are exported to Europe, America, Europe, Central Europe, Western Europe, Southeast Asia, Asia-Pacific and other countries and area.


PCB, FPC process production capability

Our Quality processes include

  1. IQC: Incoming Quality Control (Incoming Materials Inspection)
  2. First Article Inspection for every process
  3. IPQC: In Process Quality Control
  4. QC: 100% Test & Inspection
  5. QA: Quality Assurance based on QC inspection again
  6. Workmanship: IPC-A-610, ESD
  7. Quality Management based on CQC, ISO9001:2008, ISO 14001:2004

PCB, FPC process production capability

Technical ltem MassProduct Advanced Technology
2016 2017 2018
Max.Layer Count 26L 36L 80L
Through-hole plate 2~45L 2~60L 2~80L
Max.PCBSize(in) 24*52" 25*62" 25*78.75"
The layer number of FPC 1~36L 1~50L 1~60L
Max.PCBSize(in) 9.8"*196" 9.8"*196" 10"*196"Reel to reel
Layeredplatelayer 2~12L 2~18L 2~26L
Max.PCBSize(in) 9"*48" 9"*52" 9"*62"
Combination of hard and soft layers 3~26L 3~30L 3~50L
Interconnect HDI 5+X+5Interconnect HDI 7+X+7Interconnect HDI 8+X+8,Interconnect HDI
HDI PCB 4~45L 4~60L 4~80L
Interconnect HDI 3+20+3 4+X+4Interconnect HDI 4+X+4,Interconnect HDI
Max.PCBSize(in) 24"*43" 24"*49" 25"*52"
Material FR-4 Rogers FR-4 Rogers FR-4 Rogers
Base material Halogenfree,LowDK Halogenfree,LowDK Halogenfree,LowDK
Build-up Material FR-4 FR-4 FR-4
BOard,Thickness(mm) Min.12L(mm) 0.43 0.42~8.0mm 0.38~10.0mm
Min.16L(mm) 0.53 1.60~8.0mm 0.45~10.0mm
Min.18L(mm) 0.63 2.0~8.0 0.51~10.0mm
Min.52L(mm) 0.8 2.50~8.0mm 0.65~10.0mm
MAX(mm) 3.5 10.0mm 10.0mm
Min.CoreThickness um(mil) 254"(10.0) 254"(10.0) 0.10~254(10.0mm)
Min.Build up Dielectric 38(1.5) 32(1.3) 25(1.0)
BaseCopperWeight Inner Layer 4/1-8 OZ 4/1-15 OZ 4/1-0.30mm
Out Layer 4/1-10 OZ 4/1-15 OZ 4/1-30 OZ
Gold thick 1~40u" 1~60u" 1~120u"
Nithick 76~127u" 76~200u" 1~250u"
Min.HOle/Land um(mil) 150/300(6/12) 100/200(4/8) 100/200(4/8)
Min.Laser via/landum(mil) 60/170(2.4/6.8) 50/150(2/6) 50/150(2/6)
Min. IVH,Hole size/landum(mil) 150/300(6/12) 100/200(4/8) 100/200(4/8)
DieletricThickness 38(1.5) 32(1.3) 32(1.3)
125(5) 125(5) 125(5)
SKipvia Yes Yes Yes
viaoNhie(laserviaon BuriedPTH) Yes Yes Yes
Laser Hole Filling Yes Yes Yes
Technicalltem Mass Product Advanced Technolgy
2017year 2018year 2019year
Drill hole depth ratio ThroughHole 2017year .40:1 .40:1
Aspet Ratio Micro Via .35:1 1.2:1 1.2:1
Copper Filling Dimple Size um(Mil) 10(0.4) 10(0.4) 10(0.4)
Min.LineWidth&space lnner Layer um(mil) 45/45(1.8/1.8) 38/38(1.5/1.5) 38/38(1.5/1.5)
Plated Layer um(mil) 45/45(1.8/1.8) 38/38(1.5/1.5) 38/38(1.5/1.5)
BGAPitch mm(Mil) 0.3 0.3 0.3
Min.PTH Hole ring um(mil) 75(3mil) 62.5(2.5mil) 62.5(2.5mil)
Line Width Control ∠2.5MIL ±0.50 ±0.50 ±0.50
2.5Mil≤L/W∠4mil ±0.50 ±0.50 ±0.50
≦3mil ±0.60 ±0.60 ±0.60
Laminated structure Layer by layer 3+N+3 4+N+4 5+N+5
Sequential Build-up 20L Any Layer 36L Any Layer 52L Any Layer
Multi-layer overlay N+N N+N N+N
N+X+N N+X+N N+X+N
sequential Lamination 2+(N+X+N)+2 2+(N+X+N)+2 2+(N+X+N)+2
Soft and hard bonding 2+(N+X+N)+2 2+(N+X+N)+2 2+(N+X+N)+2
PTH filling process PTH resin plug hole + plating fill
Electroplated hole/copper plug hole
PTH resin plug hole + plating fill
Electroplated hole/copper plug hole
PTH resin plug hole + plating fill
Electroplated hole/copper plug hole

PCB, FPC main material supply

NO supplier Supply material name Material origin
1 Japan High frequency materials, PI, covering membrane,Copper berth Mitsubishi Japan
2 dupont High frequency materials, PI, covering film, dry film,Copper berth Japan
3 panasonic High frequency materials, PI, covering membrane,Copper berth Japan
4 SanTie PI, covering membrane Japan
5 Born good FR-4,PI,PP,Copper berth shenzhen, China
6 A rainbow PI, covering membrane,Copper berth Taiwan
7 teflon High frequency materials The United States
8 Rogers High frequency materials The United States
9 Nippon Steel PI, covering membrane,Copper berth Taiwan
10 sanyo PI, covering membrane,Copper berth Japan
11 South Asia FR-4,PI,PP,Copper berth Taiwan
12 doosan FR-4,PP South Korea
13 Tai Yao plate FR-4,PP,Copper berth Taiwan
14 Alight FR-4,PP,Copper berth Taiwan
15 Yaoguang FR-4,PP,Copper berth Taiwan
16 Yalong FR-4,PP The United States
17 ISOAL FR-4,PP Japan
18 OAK Buried, buried resistance, PP Japan
19 United States 3M FR-4,PP The United States
20 Bergs Copper and aluminum matrix Japan
21 The sun ink Taiwan
22 Murata ink Japan
23 generous andbenevolent PI, covering membrane,Copper berth China's jiangxi
24 Yasen PPI, covering membrane China jiangsu
25 Yong Sheng Tai ink China guangdong panyu
26 mita ink Japan
27 Transcript ceramic material Taiwan
28 HOME ceramic material Japan
29 Fe-Ni-Mn Alloy Invar, Section Steel Taiwan

PCB, FPC product application field
Various digital products, automotive new energy, automotive products, military, aerospace, medical, wireless terminals, wired terminals, communication equipment, communication stations, finance, industrial industrial control, consumer electronics, educational equipment, smart devices, smart products, security, LED and other electronic products:

FAQ:
Q: What files do you use in PCB fabrication?
A: Gerber or Eagle, BOM listing, PNP and Components Position
Q: Is it possible you could offer sample?
A: Yes, we can custom you sample to test before mass production
Q: When will I get the quotation after sent Gerber, BOM and test procedure?
A: Within 6-48hours for PCB quotation and around 24-48 hours for PCBA quotation.
Q: How can I know the process of my PCB production?
A: 5-15days for PCB production and components purchasing, and 14-18 days for PCB assembly and Testing
Q: How can I make sure the quality of my PCB?
A: We ensure that each piece of PCB,PCBA products work well before shipping. We'll test all of them according to your test procedure.

8-layer 3rd-order Bluetooth headset with hard and soft HDI, ENIG Surface Finishing Printed Circuit Board Pcb FR4 / Polyi

China 8-layer 3rd-order Bluetooth headset with hard and soft HDI, ENIG Surface Finishing Printed Circuit Board Pcb FR4 / Polyi for sale

8-layer 3rd-order Bluetooth headset with hard and soft HDI, ENIG Surface Finishing Printed Circuit Board Pcb FR4 / Polyi

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